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Delamination analysis in bimaterials consisting of shape memory alloy and elastoplastic layers

机译：由形状记忆合金和弹塑性层组成的双材料的分层分析

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摘要

Bimetallic shape memory alloy composites, consisting of an active layer of shape memory alloy and a metallic elastoplastic passive layer, are used for designing the sensors and actuators. Delamination analysis in SMA/elastoplastic bimaterial composites is numerically investigated in this study due to the important effects of interface cracks on failure and load bearing response of such composites. It is known that homogeneous elastoplastic material and shape memory alloy show different path-dependent behaviors for prediction of energy release rate near the crack tip. Therefore, evaluation of J-integral for an interface crack between SMA and elastoplastic layers remains a highly complex issue in fracture analysis of such bimaterials. Presuming small-scale phase transformation and yielding zones, path dependency of J-integral for this composite is investigated for a range of mixed-mode loading conditions, and the elastoplastic material properties including the Young's modulus, hardening slope and yield stress. In addition, the maximum transformation strain within the framework of J(2) plasticity for the elastoplastic material and the thermo-mechanical coupling model of Boyd and Lagoudas for the shape memory alloy are studied. Finally, the influence of mixed-mode loading rates on the crack tip fields is comprehensively assessed.
机译：由形状记忆合金的活性层和金属弹塑性钝化层组成的双金属形状记忆合金复合材料用于设计传感器和执行器。由于界面裂纹对此类复合材料的破坏和承载响应的重要影响，本研究对SMA /弹塑性双材料复合材料的分层分析进行了数值研究。众所周知，均匀的弹塑性材料和形状记忆合金在预测裂纹尖端附近的能量释放速率时表现出不同的路径依赖行为。因此，在这种双材料的断裂分析中，评估SMA和弹塑性层之间的界面裂纹的J积分仍然是一个非常复杂的问题。假定存在小规模的相变和屈服区，研究了该复合材料的J积分在一系列混合模式载荷条件下的路径依赖性，以及包括杨氏模量，硬化斜率和屈服应力在内的弹塑性材料特性。此外，研究了弹塑性材料在J（2）可塑性范围内的最大转变应变以及形状记忆合金的Boyd和Lagoudas热机械耦合模型。最后，综合评估了混合模式加载速率对裂纹尖端场的影响。

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