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Effect of surface micro-pits on mode-II fracture toughness of Ti-6Al-4V/ PEEK interface

机译:表面微坑对Ti-6Al-4V / PEEK界面II型断裂韧性的影响

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摘要

Herein, the delamination issue of TiGr(TC4/PEEK/Cf) laminate is addressed by investigating the influence of TC4(Ti-6Al-4V) surface micro-pits on mode-II interfacial fracture toughness of TC4/PEEK interface through experimental and finite element modeling. The micro-pits unit cell, unit strip and the end notched flexure (ENF) models are established based on the finite element simulations and the effect of micro-pit size parameters is studied in detail. The results of micro-pits unit cell model reveal that the presence of micro-pits can effectively buffer the interfacial stress concentration under mode-II loading conditions. Furthermore, the micro-pits unit strip model, with different micro-pit sizes, is analyzed to obtain the interface parameters, which are converted and used in the ENF model. Both the unit strip and ENF models conclude that the presence of interfacial micro-pits effectively improves the mode-II fracture toughness. It is worth mentioning that the utilization of converted interface parameters in ENF model avoided the limitation of micro-pit size and reduced the workload. Finally, the experimental and computational ENF results exhibited excellent consistency and confirmed the reliability of the proposed finite element models. The current study provides useful guidelines for the design and manufacturing of high-performance TC4/PEEK interfaces for a wide range of applications.
机译:本文通过实验和有限元研究了TC4(Ti-6Al-4V)表面微坑对TC4 / PEEK界面的II型界面断裂韧性的影响,从而解决了TiGr(TC4 / PEEK / Cf)层压板的分层问题。元素建模。在有限元模拟的基础上,建立了微孔晶胞,单元条和端部弯曲挠度(ENF)模型,并详细研究了微孔尺寸参数的影响。微坑晶胞模型的结果表明,微坑的存在可以有效地缓冲II型加载条件下的界面应力集中。此外,分析具有不同微坑尺寸的微坑单元条模型,以获得界面参数,将其转换并用于ENF模型。单元条带模型和ENF模型都得出结论,界面微坑的存在有效地提高了II型断裂韧性。值得一提的是,在ENF模型中利用转换后的接口参数避免了微坑尺寸的限制,减少了工作量。最后,ENF的实验和计算结果显示出极好的一致性,并证实了所提出的有限元模型的可靠性。当前的研究为针对各种应用的高性能TC4 / PEEK接口的设计和制造提供了有用的指导。

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