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A multi-layer integrated thermal protection system with C/SiC composite and Ti alloy lattice sandwich

机译:具有C / SiC复合材料和Ti合金晶格三明治的多层集成热保护系统

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摘要

In this paper, a multi-layer integrated thermal protection system (ITPS) is proposed and compared with two existed ITPS. This multi-layer ITPS consists of a carbon fiber reinforced silicon carbide matrix composite (C/SiC) panel, a glass wool layer and a titanium (Ti) lattice sandwich filled with glass wool. In order to satisfy the aerodynamic shape requirement of hypersonic vehicles, a curved ITPS structure is concerned in this study. Multi-layer curved ITPS and single-layer curved ITPS made of Ti alloy and C/SiC composite are firstly analyzed and discussed under typical aerodynamic heating and pressure loads. Numerical results show that the proposed multi-layer ITPS provides efficient thermal insulation and load bearing properties compared with the C/SiC sandwich ITPS and Ti alloy sandwich ITPS. Secondly, multi-layer curved ITPS samples are fabricated. Experimental tests and numerical validation are carried out to evaluate the heat transfer characteristics of the ITPS samples.
机译:本文提出了一种多层综合热保护系统(ITPS),并将其与现有的两种系统进行比较。这种多层ITPS由碳纤维增强的碳化硅基复合材料(C / SiC)面板,玻璃棉层和填充有玻璃棉的钛(Ti)晶格三明治组成。为了满足高超音速飞行器的空气动力学形状要求,本研究关注弯曲的ITPS结构。首先分析和讨论了在典型的气动加热和压力载荷下,由钛合金和C / SiC复合材料制成的多层弯曲ITPS和单层弯曲ITPS。数值结果表明,与C / SiC夹层ITPS和Ti合金夹层ITPS相比,提出的多层ITPS提供了有效的隔热和承载性能。其次,制造多层弯曲ITPS样品。进行了实验测试和数值验证,以评估ITPS样品的传热特性。

著录项

  • 来源
    《Composite Structures》 |2019年第12期|111507.1-111507.9|共9页
  • 作者

  • 作者单位

    Northwestern Polytech Univ State IJR Ctr Aerosp Design & Addit Mfg Xian 710072 Shaanxi Peoples R China|Northwestern Polytech Univ Shaanxi Engn Lab Aerosp Struct Design & Applicat Xian 710072 Shaanxi Peoples R China;

    Northwestern Polytech Univ State IJR Ctr Aerosp Design & Addit Mfg Xian 710072 Shaanxi Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Thermal protection system; C/SiC composite; Lattice sandwich; Experiment; Finite element simulation;

    机译:热保护系统;C / SiC复合材料;格子三明治实验;有限元模拟;

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