机译:热环境中压力加载的FGM混合圆柱壳的后屈曲
School of Ocean and Civil Engineering, Shanghai Jiao Tong University, 1954 Hua Shan Road, Shanghai 200030, People's Republic of China;
functionally graded material; heat conduction; temperature-dependent properties; thermo-piezoelectric effect; hybrid laminated cylindrical shell; postbuckling;
机译:在热环境中纳米管增强的复合圆柱壳的后屈曲,第二部分:压力加载的壳
机译:热环境中轴向加载的FGM混合圆柱壳的后屈曲
机译:热环境中压力加载的功能梯度圆柱壳的屈曲后分析
机译:具有温度依赖性特性的FGM圆柱壳的热风菌
机译:用惠氏的后屈曲法分析不同类型圆柱壳的屈曲,后屈曲和缺陷敏感性。
机译:弹性介质包围螺旋瓦楞三明治FGM圆柱壳的非线性屈曲行为
机译:由热环境中弹性介质包围的轴向加载的CNT加固复合圆柱壳的屈曲和出版物