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The effect of thermal mismatch on Z-pinned laminated composite structures

机译：热失配对Z钉叠层复合结构的影响

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摘要

Z-pinning is a method of improving the through-thickness properties of composite laminates by inserting a solid pin through the laminate prior to curing. The thermal expansion mismatch between the Z-pin and base laminate produces large residual stresses during the cure cycle. Finite element modelling has shown that these stresses are greater than the failure stress of standard resin systems indicating the resin around the Z-pin should fail. This was confirmed through microscopy, which showed cracking around the perimeter of the Z-pin. Changing the material properties and dimension of the model to represent different Z-pinning situations could not significantly reduce the residual stresses, indicating cracking should occur in all Z-pinned laminates. These results show that probably all published Z-pinning properties have been obtained from laminates that would have exhibited cracking, indicating that the improved through-thickness properties are due more to mechanical interlocking than bonding. Questions are raised about the suitability of using Z-pinned laminates in specific applications, and the effects of increased moisture ingress and long term durability.
机译：Z钉扎法是通过在固化之前通过将实心销钉穿过层压板来改善复合材料层压板的贯穿厚度特性的方法。 Z针和基础层压板之间的热膨胀不匹配会在固化周期中产生较大的残余应力。有限元建模表明，这些应力大于标准树脂系统的破坏应力，表明Z销周围的树脂会破坏。通过显微镜证实了这一点，该显微镜显示了Z形销的周边出现裂纹。更改模型的材料特性和尺寸以代表不同的Z钉扎情况并不能显着减少残余应力，这表明在所有Z钉扎的层压板中都应发生裂纹。这些结果表明，可能所有已公开的Z钉扎性能都是从可能表现出开裂的层压材料中获得的，这表明改进的贯穿厚度性能更多是由于机械互锁而不是粘结。对于在特定应用中使用Z钉层压板的适用性以及增加的水分进入和长期耐久性的影响，人们提出了疑问。

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  • 来源
    《Composite Structures》 |2004年第4期|p.189-195|共7页
  • 作者

    Roderick D. Sweeting; Rodney S. Thomson;

  • 作者单位

    Cooperative Research Centre for Advanced Composite Structures Ltd., 506 Lorimer Street, Fishermans Bend, Victoria 3207, Australia;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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