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Analysis method for bonded patch repair of a skin with a cutout

机译:带切口的皮肤粘合贴剂修复的分析方法

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摘要

This study presents an analysis method for determining the transverse shear and normal stresses in the adhesive and in-plane stresses in the repair patch and in the repaired skin. The damage to the skin is represented in the form of a cutout. The circular or elliptical cutout can be located arbitrarily under the patch. The patch is free of external tractions while the skin is subjected to general loading along its external edge. The method utilizes the principle of minimum potential energy in conjunction with complex potential functions to analyze a patch-repaired damage configuration.
机译:这项研究提出了一种分析方法,用于确定胶粘剂中的横向剪切力和法向应力以及修复贴片和修复后的皮肤中的面内应力。对皮肤的损害以切口的形式表示。圆形或椭圆形的切口可以位于贴片下方。当皮肤沿其外部边缘承受一般负荷时,贴片无外部牵引力。该方法利用最小势能原理结合复杂的势函数来分析补丁修复的损坏配置。

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