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Optimal dimension of PQFP by using Taguchi method

机译：Taguchi法确定PQFP的最佳尺寸

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This paper addresses the sue of finite element techniques and Taguichi method to optimize package design for plastic quad flat packages (PQFP) with and without a heat slug assembled. Warpage in both types of PQFPs during the curing process of temperature changing from 175 deg C to room temperature was simulated by using three-dimensioanl finite element models. Taguchi method was applied to both models to isolate the major control factors that minimize package warpage. Results of this analysis suggest that PQFPs without heat slug should keep the thickness of both mod compound and die pad as smaller as possible. For PQFPs with heat slug assembled, it was found that larger Young's modulus of heat slug material and smaller values of temperature coefficient of expansions of mold compound, die pad, and die attachment would yield the least warpage.
机译：本文讨论了有限元技术和Taguichi方法的使用，以优化带有或不带有散热片的塑料四方扁平包装（PQFP）的包装设计。通过使用三维有限元模型模拟了从175摄氏度到室温的温度固化过程中两种PQFP的翘曲。 Taguchi方法应用于这两种模型，以隔离使包装翘曲最小的主要控制因素。该分析结果表明，没有散热片的PQFP应该使Mod复合材料和管芯焊盘的厚度尽可能小。对于组装有散热片的PQFP，发现散热片材料的杨氏模量较大，而模塑料，芯片垫和芯片附着的膨胀温度系数较小，则翘曲最小。

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