Pushing the Printed Electronics Envelope

TOM KEVAN

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Pushing the Printed Electronics Envelope

机译：推动印刷电子信封

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PRINTED ELECTRONICS DEVELOPERS have started launching the technology into the third dimension, throwing off the constraints of flat, 2D architectures to integrate electronics directly into a product's geometry. Until recently, electronics companies designed and manufactured components, systems and layers in 2D. Then they finished off the lengthy process by performing steps like drilling, pressing and plating to connect the separate dies to create a multi-layer circuit board.

机译：印刷电子开发人员已开始将该技术推广到三维应用，摆脱了平面2D架构的限制，可以将电子产品直接集成到产品的几何形状中。直到最近，电子公司仍以2D设计和制造组件，系统和层。然后，他们通过执行钻孔，压制和电镀等步骤以连接独立的裸片以创建多层电路板，从而结束了漫长的过程。

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《Desktop engineering》 |2019年第8期|14-17|共4页
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TOM KEVAN;
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4. Pushing the Boundaries of 3D-MID: Pulse-Width Modulated Light Technology for Enhancing Surface Properties and Enabling Printed Electronics on FFF-Printed Structures [C] . Daniel Gräf, Simone Neermann, Lisa Stuber, International Congress on Molded Interconnect Devices . 2018

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Pushing the Printed Electronics Envelope

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