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Sb Surface Modification of Pd by Mimetic Underpotential Deposition for Formic Acid Oxidation

机译:通过模拟低电位沉积法对Pb的Sb表面改性以进行甲酸氧化

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The newly proposed mimetic underpotential deposition (MUPD) technique was extended to modify Pd surfaces with Sb through immersing a Pd film electrode or dispersing Pd/C powder in a Sb(III)-containing solution blended with ascorbic acid (AA). The introduction of AA shifts down the open circuit potential of Pd substrate available to achieve suitable Sb modification. The electrocatalytic activity and long-term stability towards HCOOH electrooxidation of the Sb modified Pd surfaces (film electrode or powder catalyst) by MUPD is superior than that of unmodified Pd and Sb modified Pd surfaces by conventional UPD method. The enhancement of electrocatalytic performance is due to the third body effect and electronic effect, as well as bi-functional mechanism induced by Sb modification which result in increased resistance against CO poisoning.
机译:通过将Pd膜电极浸入或将Pd / C粉末分散在与抗坏血酸(AA)混合的含Sb(III)的溶液中,新提出的模拟不足电位沉积(MUPD)技术得以扩展以用Sb修饰Pd表面。 AA的引入降低了可用于实现合适的Sb改性的Pd衬底的开路电势。 MUPD对Sb修饰的Pd表面(膜电极或粉末催化剂)进行HCOOH电氧化的电催化活性和长期稳定性优于常规UPD方法的未修饰Pd和Sb修饰的Pd表面。电催化性能的提高归因于第三体效应和电子效应,以及由于Sb修饰引起的双功能机理,从而导致了对CO中毒的抵抗力增强。

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