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首页> 外文期刊>Current Journal of Applied Science and Technology >Material Selection for Heat Sinks in HPCMicrochip-Based Circuitries
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Material Selection for Heat Sinks in HPCMicrochip-Based Circuitries

机译：基于HPCMicrochip的电路中散热器的材料选择

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Heat sinks are integral components of high-powered computing system (HPC) microchips which are extensively used in modern electronics and power supply circuitries with intelligence and effective control capability. Integrated circuits typically generate large amount of heat sufficient to damage the chip and other sensitive electronic components of the circuitry. Heat sinks are applied to accomplish a continuous cooling of the microchip by conducting thermal energy away from it and dissipating same into the environment. Suitable materials for the heat sink are therefore important for effective protection of the microchip. In this study, material selection for heat sinks applicable in microchip-based circuitries was carried out using the CES EduPack software. Over 3,000 candidate materials were first screened using design constraints after which shortlisted ones were ranked using design objectives. Appropriate trade-offs were applied to select the final material which was an alloy adjudged most suitable for the defined function, objectives and constraints.
机译：散热器是高功率计算系统（HPC）微芯片的组成部分，该芯片以其智能和有效的控制能力广泛用于现代电子设备和电源电路中。集成电路通常会产生大量热量，足以损坏芯片和电路的其他敏感电子组件。通过将热能传导出去并将其散发到环境中，可以使用散热器来实现微芯片的连续冷却。因此，用于散热器的合适材料对于有效保护微芯片很重要。在这项研究中，使用CES EduPack软件对适用于基于微芯片的电路的散热器的材料进行了选择。首先使用设计约束条件筛选了3,000多种候选材料，然后使用设计目标对入围材料进行了排名。进行适当的权衡以选择最终材料，该材料是最适合于确定的功能，目标和约束的合金。

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