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首页> 外文期刊>American journal of applied sciences >Evaluating the Maintenance Performance of the Semiconductor Factories Based on the Analytical Hierarchy Process and Grey Relational Analysis | Science Publications
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Evaluating the Maintenance Performance of the Semiconductor Factories Based on the Analytical Hierarchy Process and Grey Relational Analysis | Science Publications

机译：基于层次分析法和灰色关联度的半导体工厂维修性能评估科学出版物

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> Problem statement: Maintenance is an important factor in semiconductor factories, not only because of costs and the need for the uninterrupted operation of semiconductor equipment, but also the time and expense required for maintenance. If maintenance procedures are not performed properly, the equipment will have low efficiency or break down, production capacity will decrease and the company will incur extra costs. Therefore, the evaluation of maintenance performance has become a critical issue in semiconductor industries. Approach: This study evaluated maintenance performance by using the Analytical Hierarchy Process (AHP), Grey Relational Analysis (GRA) and the Technique for Order Preference by Similarity to Ideal Solution (TOPSIS). The weight of maintenance indicators was derived by AHP method, which were input to the GRA and TOPSIS method for evaluate the performance of Condition-Based Maintenance (CBM) and Time-Based Maintenance (TBM) strategies. Results: Actual data was provided by a well-known semiconductor factory in Taiwan. This study evaluated and compared the performance of different maintenance strategies implemented in semiconductor companies. Empirical results indicated that the CBM strategy had better maintenance performance than the TBM strategy in semiconductor companies and the maintenance indicators which should be improved were also identified. Conclusion/Recommendations: The feasibility of the maintenance evaluation method was demonstrated through an actual scenario, which can help managers make decisions objectively and distinguish the advantages and disadvantages of the maintenance strategy.
机译： > 问题陈述：维护是半导体工厂中的重要因素，不仅因为成本和半导体设备不间断运行的需要，而且还因为维护半导体设备所需的时间和费用。保养。如果维护程序执行不当，设备效率低下或出现故障，生产能力将下降，并且公司将承担额外的费用。因此，维护性能的评估已成为半导体行业的关键问题。 方法：本研究通过使用层次分析法（AHP），灰色关联分析（GRA）和基于与理想解决方案相似性的订单偏好技术（TOPSIS）来评估维护性能。维护指标的权重通过AHP方法得出，输入到GRA和TOPSIS方法中，以评估基于状态的维护（CBM）和基于时间的维护（TBM）策略的性能。 结果：实际数据是由台湾一家著名的半导体工厂提供的。这项研究评估并比较了半导体公司实施的不同维护策略的性能。实证结果表明，在半导体公司中，CBM策略的维护性能优于TBM策略，并确定了需要改进的维护指标。 结论/建议：通过实际场景演示了维护评估方法的可行性，它可以帮助管理人员客观地做出决策并区分维护策略的优缺点。

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