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首页> 外文期刊>American journal of applied sciences >The Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) Deposition | Science Publications
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The Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) Deposition | Science Publications

机译：化学镍浸金（ENIG）沉积中Al焊盘表面处理的特性科学出版物

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摘要

> This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment to achieve successful nickel deposition and provide reliable interconnection of under bump metallurgy in advanced packaging. During this treatment process, the aluminum pad was cleaned, activated and then coated with a layer of zinc. Systematic study was carried out to determine the best parameters, through multiple and various exposure times of the zincation process and zincation solution concentration effect on the Ni/Au surface roughness and aluminum dissolution rate on the bond pad during multiple zincation process. The ball shear strength was evaluated between eutectic 37Pb/63Sn solder ball and under bump metallurgy (UBM) interfaces across multiple zincation process. Scanning Electron Microscope (SEM), Energy Dispersive X-Ray (EDX), Atomic Force Microscopy (AFM), Focused Ion Beam (FIB) and ball shear tester were used as analytical tools. The results suggest that the multiple zincation process consistently produces a smoother surface of ENIG UBM and consequently provides a better shear strength.
机译： >这项研究报告了许多实验，这些实验旨在表征化学镀镍浸金（ENIG）之前的铝焊盘表面。在ENIG工艺中，需要对铝焊盘进行特殊处理，以实现成功的镍沉积，并提供高级封装中凸点下冶金的可靠互连。在此处理过程中，清洁，活化铝垫，然后涂上一层锌。通过多次和不同的镀锌过程暴露时间以及镀锌溶液浓度对多次镀锌过程中焊盘上Ni / Au表面粗糙度和铝溶解速率的影响，进行了系统研究，以确定最佳参数。评估了在多次镀锌过程中共晶37Pb / 63Sn焊球与凸点冶金（UBM）界面之间的抗剪切强度。使用扫描电子显微镜（SEM），能量色散X射线（EDX），原子力显微镜（AFM），聚焦离子束（FIB）和球剪切测试仪作为分析工具。结果表明，多次镀锌工艺始终可产生ENIG UBM较光滑的表面，因此可提供更好的剪切强度。

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