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首页> 外文期刊>International Journal of Electrochemical Science >Effect of Sodium Dodecyl Sulfate on Copper Anodic Dissolution in Phosphoric Acid Solution
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Effect of Sodium Dodecyl Sulfate on Copper Anodic Dissolution in Phosphoric Acid Solution

机译：十二烷基硫酸钠对磷酸溶液中铜阳极溶解的影响

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In Electrochemical Mechanical Planarization process (ECMP), concentrated phosphoric acid is usuallyused as electrolyte. Role of sodium dodecyl sulfate (SDS) in anodic dissolution of Cu in concentratedphosphoric acid was studied by Cyclic Voltammetry (CV), inhibition efficiency (IE) calculation andin-situ observation of the Cu electrode surface at anodic overpotentials. It was found that presence ofSDS enhances surface passivation of Cu in both active and passive potential regions. Moreover, in thepassive region, introduction of SDS results in fine, close-packed and stable layers of oxygen bubbles,which can effectively inhibit anodic dissolution of Cu. A correlation was established between theelectrochemical impedance spectroscopy and the structure of the passive film. The values ofRct,Yct,Rf,Yf increase with the addition of SDS indicate that SDS is helpful to form the film of oxidecopper. Therefore, SDS can be used as an additive to achieve excellent planarization efficiency forECMP.
机译：在电化学机械平坦化工艺（ECMP）中，浓磷酸通常用作电解质。通过循环伏安法（CV），抑制效率（IE）计算以及在阳极超电势下铜电极表面的原位观察，研究了十二烷基硫酸钠（SDS）在铜在浓磷酸中的阳极溶解中的作用。发现SDS的存在增强了在有源和无源电势区域中Cu的表面钝化。此外，在无源区中，SDS的引入会导致细微，密堆积和稳定的氧气泡层，从而可以有效地抑制Cu的阳极溶解。在电化学阻抗谱和无源膜的结构之间建立了相关性。 RDS，Yct，Rf，Yf的值随着SDS的添加而增加，这表明SDS有助于形成氧化铜膜。因此，SDS可以用作添加剂，以实现ECMP优异的平面化效率。

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