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Effect of Some Organic Aldehydes on the Electropolishing of Copper in Phosphoric Acid

机译:某些有机醛对铜在磷酸中电抛光的影响

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Electropolishing of copper in phosphoric acid is considered as corrosion rate of copper and due to theeconomic importance of copper there are several researches deals with acceleration and inhibition ofthis process. From the previous studies this process may be controlled by the presence of somematerials which may cause acceleration or inhibition of this process. In this paper the electropolishingprocess inhibited with different ratio by addition of some organic aldehydes ( formaldehyde,acetaldehyde, paraldehyde, benzaldehyde, salicylaldehyde, anisaldehyde, and tolualdehyde) byaddition with concentration ( 10-5 - 10-2 mol. l-1 ).The results reveal that organic aldehydes havestrongest inhibitive effect ranging from 14.3 61.9 % and the thermodynamic parameters anddimensionless group were present.
机译:铜在磷酸中的电抛光被认为是铜的腐蚀速率,并且由于铜的经济重要性,有许多研究致力于加速和抑制该过程。根据先前的研究,该过程可能受某些可能导致该过程加速或抑制的材料的控制。本文通过以浓度(10-5-10-2 mol.l-1)添加一些有机醛(甲醛,乙醛,对甲醛,苯甲醛,水杨醛,茴香醛和甲苯醛)以不同的比例抑制电抛光过程。结果表明,有机醛的抑菌作用最强,为14.3±61.9%,存在热力学参数和无量纲。

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