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首页> 外文期刊>International Journal of Electrochemical Science >Mechanical Properties and Corrosion Behaviour of Nanostructured Cu-rich CuNi Electrodeposited Films
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Mechanical Properties and Corrosion Behaviour of Nanostructured Cu-rich CuNi Electrodeposited Films

机译：纳米结构富铜CuNi电沉积膜的力学性能和腐蚀行为

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摘要

Nanocrystalline Cu-rich CuNi alloy thin films (with copper content ranging from 22 to 97 at%) havebeen grown by electrodeposition, using galvanostatic conditions in an electrolytic bath containing Niand Cu sulphates with a [Ni(II)]/[Cu(II)] molar ratio of 11. The Cu content is tuned by varying theapplied current density during deposition. The nanoscrystalline nature of Cu-rich CuNi thin films hasbeen achieved using saccharine as a grain refinement agent, although for high Cu content (> 90 at%)the refinement effect is less pronounced. Due to the nanocrystalline character of the films, low surfaceroughness, good compactness, and outstanding mechanical properties (e.g. nanoindentation hardnessvalues of approximately 7 GPa) are obtained, particularly for Cu percentages below 70 at%. Thepresence of stacking faults also contributes to the observed high strength. The films show goodcorrosion protective behaviour in a 3.5 wt% NaCl medium, with corrosion potentials more positivethan the bare substrate (pure-Cu) and lower corrosion current density values ranging from 1.8 to 5.42 /cm .
机译：在含有Ni和Cu的硫酸盐和[Ni（II）] / [Cu（II）的电解槽中，采用恒电流条件，通过电沉积法生长了富含铜的纳米晶CuNi合金薄膜（铜含量为22至97 at％）。摩尔比为11。通过改变沉积过程中施加的电流密度来调整Cu含量。使用糖精作为晶粒细化剂已经获得了富含铜的CuNi薄膜的纳米晶体性质，尽管对于高含量的铜（> 90 at％），细化效果并不明显。由于薄膜的纳米晶体特性，特别是对于铜含量低于70at％的情况，可获得低的表面粗糙度，良好的致密性和优异的机械性能（例如，纳米压痕硬度值约为7GPa）。堆垛层错的存在也有助于观察到的高强度。该膜在3.5 wt％的NaCl介质中显示出良好的腐蚀防护行为，其腐蚀电位比裸露的基材（纯铜）更强，腐蚀电流密度值范围从1.8到5.42 / cm。

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