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首页> 外文期刊>International Journal of Electrochemical Science >Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid
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Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

机译：溴化钠对深共熔溶剂型离子液体电沉积Sn，Cu，Ag和Ni的影响

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摘要

A number of studies into the influence of additives on the electrodeposition of metals from aqueoussolution have been reported in the literature. However, very few have studied the influence of additiveson metal electrodeposition in Deep Eutectic Solvents (DESs). This work will show, for the first time,the effect of sodium bromide on the electrodeposition of tin, copper, silver and nickel from a deepeutectic solvent (DES)-based ionic liquid consisting of a stoichiometric 1:2 mix of choline chlorideand ethylene glycol (Ethaline 200). It is shown that in the presence of sodium bromide, bright andsmooth Cu and Ni deposits were formed. Cyclic voltammetry and chronocoulometry have been used toexamine the electrochemical properties of the plating liquids in both the absence and presence ofsodium bromide. It was found that the redox peak currents of the Sn and Ag electrolytes get smallerwhen sodium bromide is added to the electrolyte solution. The resultant surface morphologies,topography and roughness of Sn, Cu, Ag and Ni were investigated by scanning electron microscopy(SEM/ EDXS) and 3D optical microscopy (3D). The current efficiency of metal deposits was found toincrease when the deposition was achieved from an electrolyte that contained sodium bromide.
机译：文献中已经报道了许多有关添加剂对水溶液中金属电沉积的影响的研究。但是，很少有人研究添加剂对深共晶溶剂（DES）中金属电沉积的影响。这项工作将首次显示溴化钠对基于深共熔溶剂（DES）的离子液体（由化学计量的氯化胆碱和乙二醇的1：2混合物组成）中锡，铜，银和镍的电沉积的影响（Ethaline 200）。结果表明，在溴化钠存在下，形成了光亮而光滑的Cu和Ni沉积物。在不存在和存在溴化钠的情况下，已经使用循环伏安法和计时库仑法检查镀液的电化学性能。发现当将溴化钠添加到电解质溶液中时，Sn和Ag电解质的氧化还原峰值电流变小。通过扫描电子显微镜（SEM / EDXS）和3D光学显微镜（3D）研究了所得的Sn，Cu，Ag和Ni的表面形貌，形貌和粗糙度。当从包含溴化钠的电解质中进行沉积时，发现金属沉积物的电流效率会提高。

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