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Study of the Role of Boric Acid During the Electrochemical Deposition of Ni in a Sulfamate Bath

机译:硼酸在氨基磺酸盐浴中镍电化学沉积过程中的作用研究

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Electrodeposition of nickel from a sulfamate bath with and without boric acid was studied using linearvoltammetry, electrochemical impedance spectroscopy (EIS) and electrochemical quartz crystalmicrobalance (EQCM) techniques. In the absence of boric acid, nickel hydroxide was formed in thepotential range from -0.6 to -1.4 V due to an increase in the pH value close to the electrode surfacecaused by hydrogen evolution. On the other hand, in the presence of boric acid, in the potential rangefrom -0.9 to -1.3 V the results suggest nickel deposition and the reduction of the boric acid. Theformation of nickel hydroxide and metallic nickel, in the absence and presence of boric acid,respectively, was confirmed by AFM.
机译:使用线性伏安法,电化学阻抗谱法(EIS)和电化学石英晶体微量天平(EQCM)技术研究了在含硼酸和不含硼酸的氨基磺酸盐浴中对镍的电沉积方法。在不存在硼酸的情况下,由于靠近因放氢而引起的电极表面的pH值升高,在-0.6至-1.4 V的电位范围内形成了氢氧化镍。另一方面,在硼酸的存在下,在-0.9至-1.3V的电位范围内,结果表明镍的沉积和硼酸的还原。原子力显微镜(AFM)证实了在不存在和存在硼酸的情况下氢氧化镍和金属镍的形成。

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