Aluminum Chloride Reveals the Catalytic Activity Towards Laser-Induced Deposition of Copper from Water-Based Solutions

Olga A. Lozhkina; Maxim S. Panov; Lev S. Logunov; Ilya I. Tumkin; Dmitry I. Gordeychuk; Vladimir A. Kochemirovsky

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Aluminum Chloride Reveals the Catalytic Activity Towards Laser-Induced Deposition of Copper from Water-Based Solutions

机译：氯化铝显示出对水基溶液中激光诱导沉积铜的催化活性

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Catalytic actions of aluminum chloride on laser-induced liquid-phase copper deposition process werestudied. Copper deposition experiments in aqueous solutions containing aluminum chloride upon 532nm laser irradiation at different line deposition rate were performed. The influence of pH on thedeposition rate and topology of the deposited copper microstructures was investigated. Enhanced rateof copper reduction in aluminum chloride solutions was observed. High purity copper microstructureswith good electrical conductivity were obtained.

机译：研究了氯化铝对激光诱导液相铜沉积过程的催化作用。在532nm激光辐照下以不同的线沉积速率在含氯化铝的水溶液中进行了铜沉积实验。研究了pH对沉积速率和沉积铜微结构拓扑的影响。观察到氯化铝溶液中铜还原速率的提高。获得了具有良好导电性的高纯度铜微结构。

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《International Journal of Electrochemical Science》 |2015年第8期|共8页
作者
Olga A. Lozhkina; Maxim S. Panov; Lev S. Logunov; Ilya I. Tumkin; Dmitry I. Gordeychuk; Vladimir A. Kochemirovsky;
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Aluminum Chloride Reveals the Catalytic Activity Towards Laser-Induced Deposition of Copper from Water-Based Solutions

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