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In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper

机译:铜上缓蚀剂的原位扫描微电化学表征

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In-situ scanning vibrating electrode technique (SVET) combined with other techniques (such aselectrochemical impedance spectroscopy (EIS), atomic force microscopy (AFM) and X-rayphotoelectron spectroscopy (XPS)) was used to investigate the efficiency of the mixed compound of 3- amino-1, 2, 4-triazole (ATA) and sodium molybdate (SM) as a corrosion inhibitor for copper in 3.5%NaCl solution in comparison with benzotriazole (BTA). The results indicate that copper showsextremely higher corrosion resistance in 3.5% NaCl solution with the presence of ATA-SM inhibitorthan BTA. This is due to the reaction of ATA with copper allowing the formation of a thin film2- incorporated with MoO4 ion precipitates on the surface of copper, which provides strong cathodicefficiency and thus is considerably protective.
机译:原位扫描振动电极技术(SVET)与其他技术(例如电化学阻抗谱(EIS),原子力显微镜(AFM)和X射线光电子能谱(XPS))相结合来研究3种化合物的混合化合物的效率-与苯并三唑(BTA)相比,在3.5%NaCl溶液中作为铜的腐蚀抑制剂的氨基-1,2,4-三唑(ATA)和钼酸钠(SM)。结果表明,在存在ATA-SM抑制剂的情况下,铜在3.5%NaCl溶液中显示出比BTA更高的耐腐蚀性。这是由于ATA与铜的反应,允许在铜表面上形成掺有MoO4离子沉淀物的薄膜2,这提供了很强的阴极效率,因此具有很大的保护性。

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