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A Study on Gold-Silver Alloy Electrodeposition from Pyrophosphate-Cyanide Electrolyte Using Polyethylenimine- KSeCN Additives

机译:聚乙烯亚胺-KSeCN添加剂从焦磷酸-氰化物电解质中电沉积金-银合金的研究

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This paper presents the electrodeposition of gold-silver alloys from pyrophosphate–cyanide baths in the presence of a brightener couple, polyethylenimine (Mw=600 g/mol) and KSeCN. The nanocrystalline (X-ray diffraction) single phase electrodeposits with gold content ranging from 69 to 78 wt% (energy dispersive spectroscopy) are obtained galvanostatically. The influence of the polyethylenimine and KSeCN on the reduction kinetics of gold-silver alloy electrodeposition and on the mechanism of the electrodeposition process was studied by cyclic voltammetry and chronoamperometry. We observe that polyethylenimine polarizes the alloy deposition to high cathodic potentials and enhances the gold content from ca. 45 to 75 wt% in a current density range from 5 to 10 mA.cm-2 with the support of KSeCN additive. Moreover, the alloy electrodeposition is found to proceed by a progressive nucleation and diffusion-controlled 3D growth mechanism with the addition of the brightener couple. We also discuss the morphological (scanning electron microscopy) and color changes in the presence of additives. Bright and coherent gold-silver alloy deposits are produced using the synergistic effects of polyethylenimine and KSeCN.
机译:本文介绍了在增白剂,聚乙烯亚胺(Mw = 600 g / mol)和KSeCN存在下,焦磷酸盐-氰化物浴中金银合金的电沉积。通过恒电流法获得金含量为69-78 wt%(能量分散光谱)的纳米晶(X射线衍射)单相电沉积。通过循环伏安法和计时电流法研究了聚乙烯亚胺和KSeCN对金银合金电沉积还原动力学的影响以及对电沉积过程机理的影响。我们观察到,聚乙烯亚胺使合金沉积极化至高阴极电位,并提高了约Ca的金含量。在KSeCN添加剂的支持下,在5至10 mA.cm-2的电流密度范围内为45至75 wt%。此外,发现合金电沉积通过渐进形核和扩散控制的3D生长机理进行,并加入了增白剂。我们还讨论了添加剂存在下的形态学(扫描电子显微镜)和颜色变化。利用聚乙烯亚胺和KSeCN的协同作用,可以产生明亮而连贯的金银合金镀层。

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