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首页> 外文期刊>International Journal of Electrochemical Science >Electrodeposition of Cu-Zn Intermetallic Compounds for Its Application as Electrocatalyst in the Hydrogen Evolution Reaction
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Electrodeposition of Cu-Zn Intermetallic Compounds for Its Application as Electrocatalyst in the Hydrogen Evolution Reaction

机译：Cu-Zn金属间化合物的电沉积及其在产氢反应中的电催化剂应用

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摘要

Electrodeposition of copper-zinc intermetallic compounds (particularly CuZn5) has been carried outonto an AISI 1018 steel substrate from an alkaline non-cyanide solution at room temperature. Theelectrodeposits of Cu-Zn alloy were characterized by cyclic voltammetry (CV), cronoamperometry(CA), linear voltammetry (LV), scanning electron microscopy (SEM) and X-ray diffraction (XRD)techniques. The formation of the CuZn5 intermetallic compound was associated with theunderpotential deposition of zinc and its intercalation into the lattice of copper. Analysis of thechronoamperograms obtained was used for understanding of nucleation and growth mechanism duringthe formation of these intermetallic compounds. Finally, the electrocatalytic activity of theintermetallic compounds obtained was testes for hydrogen evolution reaction.
机译：室温下，已从碱性非氰化物溶液对AISI 1018钢基材进行了铜锌金属间化合物（特别是CuZn5）的电沉积。通过循环伏安法（CV），巴氏电流法（CA），线性伏安法（LV），扫描电子显微镜（SEM）和X射线衍射（XRD）技术对Cu-Zn合金的电沉积进行了表征。 CuZn5金属间化合物的形成与锌的欠电位沉积及其嵌入铜的晶格中有关。对获得的计时电流图的分析用于理解这些金属间化合物形成过程中的形核和生长机理。最后，得到的金属间化合物的电催化活性是氢释放反应的睾丸。

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