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首页> 外文期刊>International Journal of Electrochemistry >The Effect of Water on the Tin Electrodeposition from [Bmim]HSO4 Ionic Liquid
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The Effect of Water on the Tin Electrodeposition from [Bmim]HSO4 Ionic Liquid

机译：水对[Bmim] HSO4离子液体电沉积锡的影响

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The electrodeposition of tin from SnO in ionic liquid 1-butyl-3-methylimidazolium hydrogen sulfate ([Bmim]HSO4) in the presence of water at different cathodic potential was investigated. With the addition of water to [Bmim]HSO4 ionic liquid, the electrochemical window of the electrolyte decreases and the reduction potential of Sn(II) positively shifts. The water content of ionic liquid electrolyte has a distinct effect on morphology of the deposits. As water content increased from 0 to 50% (v/v), the morphology of deposits varies from granular to hexagonal rod-like, then to hollow tubular, and finally to wire-like. The XRD phase analysis showed that both Sn and CuSn alloys were deposited in ionic liquid/water mixtures. However, in dried ionic liquids only Cu3Sn was obtained, surprisingly. The difference in the structure might be attributed to the various interactions of the ions with the Cu substrate. In addition, the deposition potential was found to play a significant role in the morphology of deposits.
机译：研究了在不同阴极电位的水存在下，SnO在离子液体1-丁基-3-甲基咪唑硫酸氢盐（[Bmim] HSO4）中从SnO上电沉积锡的过程。在[Bmim] HSO4离子液体中加水后，电解质的电化学窗口减小，Sn（II）的还原电位正向移动。离子液体电解质的水含量对沉积物的形态有明显的影响。随着水含量从0％增至50％（v / v），沉积物的形态从颗粒状变为六角棒状，然后变为空心管状，最后变为丝状。 XRD相分析表明，Sn和CuSn合金均沉积在离子液体/水混合物中。然而，令人惊讶地，在干燥的离子液体中仅获得了Cu 3 Sn。结构上的差异可能归因于离子与Cu基质的各种相互作用。另外，发现沉积潜力在沉积物的形态中起重要作用。

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