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Applying Infrared Technique as a Nondestructive Method To Assess Wheat Grain Hardness

机译:应用红外技术作为无损检测小麦籽粒硬度的方法

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Hardness, of wheat grains, is one of the most important quality characteristics used in wheat classification and determination of its marketing value. So, the key objective of this investigation applies a non-destructive method like infrared technique as an alternative method of destructive methods to assess hardness of wheat grains. The hardness characteristic was measured by two destructive methods Single-Kernel Characterization System (SKCS) and Instron Universal Testing Machine (IUTM), as reference values. Infrared technique was used to develop NIR calibration and validation model using the partial least squares (PLS) regression to assess wheat grain hardness. The best calibration and validation model for assess hardness of wheat grains were observed throughout the reference method Instron Universal Testing Machine (IUTM) within the wavelength range 950 to 1650 nm with 6 principal components (PCs) and pretreatment by Savitzky-Golay second derivative (S.G. 2supnd/sup). Where, the optimum PLS was recorded at the lowest standard error of prediction (SEP) 3.92 N with the maximum value of coefficient of prediction (Rsup2P/sup ≈ 0.91) and sufficient value of the relative prediction deviation (RPD ≈ 3.35). The accuracy of the prediction model was sufficient to use NIRS technique as a nondestructive method to estimate hardness of wheat grains for different varieties of the wheat.
机译:小麦籽粒的硬度是用于小麦分类和确定其销售价值的最重要的品质特征之一。因此,这项研究的主要目标是采用非破坏性方法(如红外技术)作为一种替代性破坏性方法来评估小麦籽粒的硬度。通过两种破坏性方法单核表征系统(SKCS)和Instron通用测试机(IUTM)测量硬度特性,作为参考值。红外技术用于开发NIR校准和验证模型,该模型使用偏最小二乘(PLS)回归来评估小麦籽粒硬度。在整个参考方法中,Instron万能试验机(IUTM)在950至1650 nm波长范围内具有6个主要成分(PC)并通过Savitzky-Golay二阶导数(SG)进行了预处理,从而观察到了用于评估小麦籽粒硬度的最佳校准和验证模型。 2 nd )。其中,最佳PLS以最低预测标准误差(SEP)3.92 N记录,且预测系数的最大值(R 2P ≈0.91)且有足够的相对预测偏差值(RPD) ≈3.35)。该预测模型的准确性足以使用NIRS技术作为非破坏性方法来估算不同小麦品种的小麦籽粒的硬度。

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