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Thermal Conductivity of Cu-Cr-Zr-Ti Alloy in the Temperature Range of 300–873 K

机译:Cu-Cr-Zr-Ti合金在300–873 K温度范围内的热导率

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In the present investigation, thermal conductivity of Cu-Cr-Zr-Ti alloy was determined as the product of the specific heat (), thermal diffusivity (), and density () in the temperature range of 300–873 K. The experimental results showed that the thermal conductivity of the alloy increased with increase in temperature up to 873 K and the data was accurately modeled by a linear equation. For comparison, thermal conductivity was also evaluated for OFHC copper in the same temperature range. The results obtained were discussed using electrical conductivity and hardness measurements made at room temperature. Transmission electron microscopy (TEM) was done to understand the microstructural changes occurring in the sample after the test. Wiedemann-Franz-Lorenz law was employed for calculating electronic and phonon thermal conductivity using electrical conductivity. On the basis of studies conducted it was deduced that in situ aging may be one of the reasons for the increase in thermal conductivity with temperature for Cu-Cr-Zr-Ti alloy.
机译:在本研究中,Cu-Cr-Zr-Ti合金的热导率被确定为在300–873 K温度范围内的比热(),热扩散率()和密度()的乘积。结果表明,合金的导热系数随着温度的升高而增加,最高温度达到873 K,并且通过线性方程对数据进行精确建模。为了进行比较,还评估了在相同温度范围内OFHC铜的热导率。使用在室温下进行的电导率和硬度测量来讨论获得的结果。进行透射电子显微镜(TEM)以了解测试后样品中发生的微观结构变化。 Wiedemann-Franz-Lorenz定律用于通过电导率计算电子和声子的热导率。根据进行的研究,可以推断出原位时效可能是Cu-Cr-Zr-Ti合金的导热系数随温度升高的原因之一。

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