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Thermal and Flow Fields In Single Board Computer Cabin Systems Using CFD Analysis

机译：使用CFD分析的单板计算机机舱系统中的热场和流场

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AbstractA detailed computational fluid dynamics (CFD) analysis of the cooling of a single board computer (SBC) cabin system is performed using the CFD software FLO EFD 9.0. Air-cooling and water-cooling are used for all major heat generating components with the attached heat sinks in it. North bridge chip, SODIMM memory module and south bridge chip are cooled by airflow. A liquid-cooling system with the microchannel heat sink is used to enhance heat transfer from the CPU. The simulation results show that all the heat generating components by this liquid-cooling system can meet their thermal design requirements. 36W CPU with H-shaped fractal-like microchannel heat sink can be maintained below 42°C at the inlet flow rate of 1.0 ml/s and pumping power of 0.06 W. Also it is decreased by 56% relative to forced air-cooling only.
机译：摘要使用CFD软件FLO EFD 9.0对单板计算机（SBC）机舱系统的冷却进行了详细的计算流体动力学（CFD）分析。空气冷却和水冷却用于所有主要的发热组件，并在其中装有散热器。北桥芯片，SODIMM内存模块和南桥芯片通过气流冷却。具有微通道散热器的液体冷却系统用于增强从CPU的传热。仿真结果表明，该液冷系统产生的所有热量均能满足其热设计要求。具有H形分形微通道散热器的36W CPU可以在入口流量为1.0 ml / s和泵浦功率为0.06 W的情况下保持在42°C以下。与仅强制风冷相比，它降低了56％ 。

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