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首页> 外文期刊>Engineering and Applied Science Research >Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory
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Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory

机译：减少热压过程中柔性印刷电路板的粘着剂缺陷缺陷：以电子元件工厂为例

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摘要

The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2?C that is higher than glass transition temperature (Tg) 60?C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification (Under 1 mm) and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate). In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample) and RGB color (From pre-scale paper) is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing). The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.
机译：这项研究的目的是减少电子工厂热压过程中柔性印刷电路板中的粘着斑缺陷。生产过程中，已使用96种柔性印刷电路板按片状产品进行加工。问题的原因包括之前和内部的热压过程。在过程开始时，冷却板和热压机之间最右边的产品温度为71.2？C，高于玻璃化转变温度（Tg）60？C。在热压工艺开始之前，这些产品的温度导致聚酰亚胺粘合剂蒸发。内部热压过程包括预热时间和加压时间。在预热时间内，问题是上下板之间的间隙不合规格（小于1 mm），并导致聚酰亚胺粘着斑。实际上，这一次需要温度和低压，这意味着在1-2 mm（上下板之间）之间的间隙。在加压时间内，热压板表面不平坦，并且产品受到的压力不足，从而导致在柔性印刷电路板上产生粘着斑。该力由预缩放纸测量，并提供RGB颜色。然后利用Photoshop程序和多元回归理论，找出颜色密度（来自标准颜色样本）和RGB颜色（来自预缩放纸）的关系。应用该公式与缺陷进行比较，以找出合适的颜色密度（减少缺陷）。提供的解决方案包括减小热压工艺之前冷却板与热压机之间的间隙调节，在预热时间内在规定范围内调节板，以及在加压时间内进行压板抛光。研究和解决的结果可将缺陷从总研究产品的24.4％减少到7.2％。

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