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首页> 外文期刊>Micromachines >Direct Writing of Copper Micropatterns Using Near-Infrared Femtosecond Laser-Pulse-Induced Reduction of Glyoxylic Acid Copper Complex
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Direct Writing of Copper Micropatterns Using Near-Infrared Femtosecond Laser-Pulse-Induced Reduction of Glyoxylic Acid Copper Complex

机译：利用近红外飞秒激光脉冲诱导的乙醛酸铜络合物还原直接写入铜微图案

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We have fabricated Cu-based micropatterns in an ambient environment using femtosecond laser direct writing to reduce a glyoxylic acid Cu complex spin-coated onto a glass substrate. To do this, we scanned a train of focused femtosecond laser pulses over the complex film in air, following which the non-irradiated complex was removed by rinsing the substrates with ethanol. A minimum line width of 6.1 μm was obtained at a laser-pulse energy of 0.156 nJ and scanning speeds of 500 and 1000 μm/s. This line width is significantly smaller than that obtained in previous work using a CO 2 laser. In addition, the lines are electrically conducting. However, the minimum resistivity of the line pattern was 2.43 × 10 ?6 Ω·m, which is ~10 times greater than that of the pattern formed using the CO 2 laser. An X-ray diffraction analysis suggests that the balance between reduction and re-oxidation of the glyoxylic acid Cu complex determines the nature of the highly reduced Cu patterns in the ambient air.
机译：我们使用飞秒激光直接写入技术在周围环境中制作了基于铜的微图案，以减少旋涂在玻璃基板上的乙醛酸铜络合物。为此，我们在空气中在复合膜上扫描了一系列飞秒聚焦的飞秒激光脉冲，然后通过用乙醇冲洗基材来去除未辐照的复合物。在0.156 nJ的激光脉冲能量和500和1000μm/ s的扫描速度下，获得的最小线宽为6.1μm。该线宽显着小于先前使用CO 2激光器获得的线宽。另外，这些线是导电的。但是，线图案的最小电阻率为2.43×10 -6Ω·m，是使用CO 2激光器形成的图案的最小电阻率的约10倍。 X射线衍射分析表明，乙醛酸铜配合物的还原和再氧化之间的平衡决定了周围空气中高度还原的铜图案的性质。

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