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首页> 外文期刊>Science and technology of nuclear installation >Effect of Subcooling on Pool Boiling of Water from Sintered Copper Microporous Coating at Different Orientations
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Effect of Subcooling on Pool Boiling of Water from Sintered Copper Microporous Coating at Different Orientations

机译：过冷度对不同方向烧结铜微孔涂层水沸腾的影响

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The subcooling effect on pool boiling heat transfer using a copper microporous coating was experimentally studied in water for subcoolings of 10 K, 20 K, and 30 K at atmospheric pressure and compared to that of a plain copper surface. A high-temperature thermally conductive microporous coating (HTCMC) was made by sintering copper powder with an average particle size of 67 μm onto a 1 cm × 1 cm plain copper surface with a coating thickness of ~300 μm. The HTCMC surface showed a two times higher critical heat flux (CHF), ~2,000 kW/m2, and up to seven times higher nucleate boiling heat transfer (NBHT) coefficient, ~350 kW/m2K, when compared with a plain copper surface at saturation. The results of the subcooling effect on pool boiling showed that the NBHT of both the HTCMC and the plain copper surface did not change much with subcooling. On the other hand, the CHF increased linearly with the degree of subcooling for both the HTCMC and the plain copper surface. The increase in the CHF was measured to be ~60 kW/m2 for every degree of subcooling for both the HTCMC and the plain surface, so that the difference of the CHF between the HTCMC and the plain copper surface was maintained at ~1,000 kW/m2 throughout the tested subcooling range. The CHFs for the HTCMC and the plain copper surface at 30 K subcooling were 3,820 kW/m2 and 2,820 kW/m2, respectively. The experimental results were compared with existing CHF correlations and appeared to match well with Zuber’s formula for the plain surface. The combined effect of subcooling and orientation of the HTCMC on pool boiling heat transfer was studied as well.
机译：在水中对大气压下10 K，20 K和30 K的过冷度进行了实验，研究了使用铜微孔涂层对池沸腾传热的过冷效应，并与纯铜表面进行了比较。高温导热微孔涂层（HTCMC）是通过将平均粒径为67μm的铜粉烧结到1μcm×1μcm的纯铜表面上形成的，涂层厚度约为300μm。与普通铜表面相比，HTCMC表面的临界热通量（CHF）高约2倍，约2,000 kW / m2，而核沸腾传热系数（NBHT）高约7倍，约350 kW / m2K。饱和。过冷对池沸腾的影响结果表明，HTMCC和普通铜表面的NBHT随过冷变化不大。另一方面，对于HTCMC和纯铜表面，CHF随过冷度线性增加。对于HTCMC和平整表面，每过冷度，CHF的增加量约为60 kW / m2，因此HTCMC和平整铜表面之间的CHF差保持在〜1,000 kW / m2。在整个测试过冷范围内为m2。 HTCMC和纯铜表面在30 K过冷条件下的CHF分别为3,820 kW / m2和2,820 kW / m2。将实验结果与现有的CHF相关性进行了比较，并且似乎与Zuber的平整公式非常吻合。还研究了HTCMC过冷和取向对池沸腾传热的综合影响。

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