Effect of solid solution and aging treatment on the microstructures and properties of hot-extruded Cu-Te-Li alloys

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Effect of solid solution and aging treatment on the microstructures and properties of hot-extruded Cu-Te-Li alloys

机译：固溶和时效处理对热挤压Cu-Te-Li合金显微组织和性能的影响

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Theeffectofsolidsolutionandagingtreatmentonmechanicalperformance,electricalandthermalconductivityofhot-extrudedCu-Te-LialloysisstudiedviaDDL100electronicuniversalmachine,MVC-100A1hardnesstester,SB2230digitalelectricbridgeandDRPL-Icoefficientofthermalconductivityinstrument.ThemicrostructuresofCu-Te-LialloysafterdifferentprocessingareobservedbyCMM-20metallographicmicroscope.TheresultsshowedthatdeformedmicrostructureofCu-Te-LialloysticksdisappearedandTeelementprecipitatedasasecondphaseofCu2Teaftersolidsolutionandagingtreatment.WithTecontentincreasing,thetensilestrengthandhardnessincrease,whiletheelectricalandthermalconductivitydeclineswithinasmallrange.WhenthecontentofTereached0.505%,thetensilestrengthandhardnessofCu-Te-Lialloysticksafteragingtreatmentincreaseby21.6%and28.5%,whiletheelectricalandthermalconductivitydecreaseby5.45%and3.89%comparedwiththatofpurecopperrespectively.

机译：Theeffectofsolidsolutionandagingtreatmentonmechanicalperformance，electricalandthermalconductivityofhot-extrudedCu-TE-LialloysisstudiedviaDDL100electronicuniversalmachine，MVC-100A1hardnesstester，SB2230digitalelectricbridgeandDRPL-Icoefficientofthermalconductivityinstrument.ThemicrostructuresofCu-TE-LialloysafterdifferentprocessingareobservedbyCMM-20metallographicmicroscope.TheresultsshowedthatdeformedmicrostructureofCu-TE-LialloysticksdisappearedandTeelementprecipitatedasasecondphaseofCu2Teaftersolidsolutionandagingtreatment.WithTecontentincreasing，thetensilestrengthandhardnessincrease，whiletheelectricalandthermalconductivitydeclineswithinasmallrange.WhenthecontentofTereached0.505％，thetensilestrengthandhardnessofCu-TE-Lialloysticksafteragingtreatmentincreaseby21.6 ％和28.5％，而与纯铜相比，电导率分别降低了5.45％和3.89％。

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《Optoelectronics and Advanced Materials-Rapid Communications》 |2014年第2014期|共页
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Effect of solid solution and aging treatment on the microstructures and properties of hot-extruded Cu-Te-Li alloys

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