...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>The Open Materials Science Journal >Characteristic Analysis and Applications of Electromagnetic Shielding Materials for Wireless Communications Device
【24h】

Characteristic Analysis and Applications of Electromagnetic Shielding Materials for Wireless Communications Device

机译：无线通信设备电磁屏蔽材料的特性分析及应用

获取原文
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

As the trend of consumer electronics and mobile communications devices is obviously developing toward to miniature and high-speed processing, the problem involving with electromagnetic compatibility (EMC) or radio frequency interference (RFI) is becoming more critical for the system integration of high-speed digital and RF mixed signal platforms. This paper is mainly focusing on the characteristics analysis of various electromagnetic shielding materials by utilizing the various shielding effectiveness (SE) measuring methods developed by TDK and ASTM (ASTM D4935). We also adopt the electromagnetic interference (EMI) testing methods developed by IEC for chip level (IEC 61967-3 and IEC 61967-6) to investigate the characteristics and distribution of EMI noise sources. To effectively shield the electric, magnetic, or electromagnetic field originated from noise source, we thus analyze the shielding capability for various materials with different measuring methods. Finally, we will show the EMI reduction and RF performance improvement with implementation of shielding material on module under investigated. With the systematic measurement and analysis described in this paper, we can further identify the related EMI problem and resolve the severe chip or module level EMC problem more effectively.
机译：随着消费电子产品和移动通信设备的趋势明显朝着小型化和高速处理发展，与电磁兼容性（EMC）或射频干扰（RFI）有关的问题对于高速系统集成变得越来越关键数字和RF混合信号平台。本文主要通过利用TDK和ASTM（ASTM D4935）开发的各种屏蔽效率（SE）测量方法，对各种电磁屏蔽材料进行特性分析。我们还采用IEC为芯片级（IEC 61967-3和IEC 61967-6）开发的电磁干扰（EMI）测试方法，以研究EMI噪声源的特性和分布。为了有效地屏蔽源自噪声源的电场，磁场或电磁场，我们使用不同的测量方法分析了各种材料的屏蔽能力。最后，我们将展示在被调查的模块上采用屏蔽材料实现的EMI降低和RF性能改善。通过本文所述的系统测量和分析，我们可以进一步识别相关的EMI问题，并更有效地解决严重的芯片或模块级EMC问题。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号