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Experimental investigation of tool wear in electroplated diamond wire sawing of silicon

机译：硅金刚石金刚石线锯中刀具磨损的实验研究

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Nowadays diamond wire sawing is used as the most efficient method for manufacturing of silicon wafers. However, experimental investigation of diamond wire and abrasive wear has process based limitations and is expensive when conducted on a wire saw. Due to high material consumption, it is difficult to identify and observe individual grains. In this study, a novel experimental setup is proposed for rapid wear testing of diamond wires, which can emulate realistic grain-workpiece contact conditions considering the undeformed chip thickness and long contact lengths. Moreover, the setup allows monitoring the wear propagation of identical abrasive grains throughout lifetime. The experimental results are validated through investigations on wires used on a multi-wire saw. Wire topography is analyzed applying a proprietary software application to characterize grain wear in terms of change in the abrasive grain protrusion, base area and volume. The influence of wire wear on cutting forces and normal forces is discussed.
机译：如今，金刚石线锯被用作制造硅片的最有效方法。然而，金刚石线和磨料磨损的实验研究具有基于过程的局限性，并且在线锯上进行时昂贵。由于高材料消耗，难以识别和观察单个晶粒。在这项研究中，提出了一种新颖的实验装置，用于金刚石线的快速磨损测试，考虑到未变形的切屑厚度和较长的接触长度，该装置可以模拟现实的谷物-工件接触条件。此外，该设置允许监控整个寿命期间相同磨粒的磨损传播。通过对多线锯上使用的线的研究验证了实验结果。使用专有软件应用程序对金属丝的形貌进行了分析，以根据磨料突出，基部面积和体积的变化来表征晶粒磨损。讨论了钢丝磨损对切削力和法向力的影响。

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