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首页> 外文期刊>Journal of Materials Science and Chemical Engineering >Investigation of the Influence of Annealing Temperature on the Morphology and Growth Kinetic of Ni3Sn4 in the Ni-Sn-Solder System
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Investigation of the Influence of Annealing Temperature on the Morphology and Growth Kinetic of Ni3Sn4 in the Ni-Sn-Solder System

机译：Ni-Sn-Sold系统中退火温度对Ni3Sn4的形貌和生长动力学的影响

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摘要

The reaction between high purity nickel (99.999%) and high purity tin (99.999%) was investigated in the temperature range of 232℃ - 330℃, at short periods of annealing (1 - 60 s). The reaction kinetic was studied using cross-sectional scanning electron microscope (SEM) images. The intermetallic compound (IMC) growth was analyzed using the empirical power law and a time dependence in the range of 0.26 to 0.33 was found. The morphology of the IMC was investigated by SEM in the temperature range of 235℃ - 290℃, at annealing periods of 10 s, 30 s, and 60 s by selectively etching away the remaining elementary tin. The exposed IMC displays a change in morphology with increasing annealing temperature, demonstrating that the growth velocity of certain crystallographic orientations of the IMC is strongly influenced by the annealing temperature. Additionally, coarsening and crumbling of the IMC grains is observed, and will be discussed with respect to the responsible mechanisms.
机译：研究了高纯镍（99.999 ％）和高纯锡（99.999 ％）在232℃至330℃的温度范围内，短时间退火（1 -60 s）之间的反应。使用截面扫描电子显微镜（SEM）图像研究了反应动力学。使用经验幂律分析金属间化合物（IMC）的生长，发现时间依赖性在0.26到0.33之间。通过选择性地蚀刻掉剩余的元素锡，在235℃至290℃的温度范围，10 s，30 s和60 s的退火时间下，通过SEM研究了IMC的形貌。暴露的IMC随着退火温度的升高显示出形态上的变化，表明IMC的某些晶体取向的生长速度受退火温度的强烈影响。另外，观察到IMC晶粒的粗化和破碎，并将就其负责任的机理进行讨论。

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