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首页> 外文期刊>Journal of Materials Science and Chemical Engineering >Effect of Boron Addition on the Thermal Properties of Diamond-Particle-Dispersed Cu-Matrix Composites Fabricated by SPS
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Effect of Boron Addition on the Thermal Properties of Diamond-Particle-Dispersed Cu-Matrix Composites Fabricated by SPS

机译：硼添加对SPS制备的分散金刚石颗粒的Cu基复合材料热学性能的影响

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摘要

Diamond particle dispersed copper (Cu) matrix composites were fabricated from the powder mixture composed of diamond, pure-Cu and boron (B) by spark plasma sintering (SPS). The composites were consolidated at 1173 K for 600 s by SPS. The reaction between the diamond particle and the Cu matrix in the composite was not confirmed by SEM observation and X-ray diffraction (XRD) analysis. The relative packing density of the Cu/diamond composites increased with B addition and attained 93.2% - 95.8% at the B content range between 1.8 vol.% and 13.8 vol.%. The thermal conductivity of the diamond-dispersed Cu composite drastically increased with B addition and reached the maximum value of 689 W/mK at 7.2 vol% B. Numerous transgranular fractures of diamond particles were observed on bending fracture surfaces of Cu-B/diamond composites. This indicates strong bonding between the diamond particle and the Cu matrix in the composite. The coefficient of thermal expansion of the composite falls in the upper line of Kerner’s model.
机译：由金刚石，纯铜和硼（B）组成的粉末混合物通过火花等离子体烧结（SPS）制备了金刚石颗粒分散的铜（Cu）基复合材料。 SPS将复合材料在1173 K下固结600 s。 SEM观察和X射线衍射（XRD）分析未确认复合物中金刚石颗粒与Cu基体之间的反应。 Cu /金刚石复合材料的相对堆积密度随着B的添加而增加，在1.8％（体积）至13.8％（体积）之间的B含量范围内达到93.2％至95.8％。添加B时，金刚石分散的Cu复合材料的热导率急剧增加，在7.2 vol％B时达到689 W / mK的最大值。在Cu-B /金刚石复合材料的弯曲断裂表面观察到许多金刚石颗粒的跨晶断裂。 。这表明复合物中金刚石颗粒和Cu基体之间的牢固结合。复合材料的热膨胀系数在Kerner模型的上限。

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