Printed circuit board (PCB) miniaturization by embedded passives and sequential build-up (SBU)process methodology

Mahesh G Varadarajan; Kang J Lee; Swapan K Bhattacharya; Raghuram Pucha; Rao R Tummala; Suresh Sitaraman

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Printed circuit board (PCB) miniaturization by embedded passives and sequential build-up (SBU)process methodology

机译：通过嵌入式无源器件和顺序构建（SBU）工艺方法实现印刷电路板（PCB）的小型化

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One of the foremost design considerations in microelectronics miniaturization is the use of embedded passives which provide practical solution. In a typical circuit, over 80% of the electronic components are passives such as resistors, inductors, and capa

机译：微电子小型化中最重要的设计考虑因素之一是使用嵌入式无源器件，它们提供了实用的解决方案。在典型电路中，超过80％的电子组件是无源的，例如电阻器，电感器和电容器

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《Journal of the Indian Institute of Science》 |2013年第6期|共1页
作者
Mahesh G Varadarajan; Kang J Lee; Swapan K Bhattacharya; Raghuram Pucha; Rao R Tummala; Suresh Sitaraman;
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1. Market trends of sequential build-up (SBU) printed wiring boards (PWB) in Japan [J] . Norie Matsui Circuit World . 2001,第3期

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2. Design Method and Material Technologies for Passives in Printed Circuit Board Embedded Circuits [J] . Eberhard Waffenschmidt, Bernd Ackermann, J. A. Ferreira IEEE Transactions on Power Electronics . 2005,第3期

机译：印刷电路板嵌入式电路中无源元件的设计方法和材料技术
3. Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods [J] . Mojtaba Sarvar, Mohammad Mehdi Salarirad, Mohammad Amin Shabani Waste Management . 2015,第NOVa期

机译：基于矿物加工方法的金属与计算机印刷电路板（PCB）的表征和机械分离
4. Embedding active components inside printed circuit board (PCB) - a solution for miniaturization of electronics [C] . Palm, P., Moisala, . 2005

机译：将有源组件嵌入印刷电路板（PCB）中-电子设备小型化的解决方案
5. The development of cost and size analysis for the assessment of embedded passives in printed circuit boards. [D] . Etienne, Bevin Thomson. 2005

机译：成本和尺寸分析的发展，用于评估印刷电路板中的嵌入式无源器件。
6. Printed Circuit Board (PCB) Technology for Electrochemical Sensors and Sensing Platforms [O] . Hamed Shamkhalichenar, Collin J. Bueche, Jin-Woo Choi 2020

机译：用于电化学传感器和传感平台的印刷电路板（PCB）技术
7. Layout and fabrication process from generic to high speed printed circuit boards (PCBS) [O] . Reddy Indrani 2005

机译：从通用到高速印刷电路板（PCBS）的布局和制造过程

Printed circuit board (PCB) miniaturization by embedded passives and sequential build-up (SBU)process methodology

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