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首页> 外文期刊>Bulletin of the Korean Chemical Society >Determination of Trace Elements of Ge and P in a Gold Bonding Wire by Inductively Coupled Plasma Atomic Emission Spectrometry
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Determination of Trace Elements of Ge and P in a Gold Bonding Wire by Inductively Coupled Plasma Atomic Emission Spectrometry

机译：电感耦合等离子体原子发射光谱法测定金焊丝中的微量元素锗和磷

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Inductively coupled plasma atomic emission spectrometry (ICP-AES) was used to determine the presence of germanium and phosphorus in a pure gold bonding wire. The samples were dissolved with hydrobromic acid and nitric acid at room temperature. The quantitation limits were 0.012 mg L?1 at 265.118 nm for Ge and 0.009 mg L?1 at 177.495 nm for P. Using the mixed acid digestion formula of DIW + HBr + HNO3, the recoveries were in the range of 98-100% and the relative standard deviation was within 1.1-2.3%. On the other hand, the amount of Ge decreased by about 16.2% using DIW + HCl + HNO3, due to the formation of a volatile compound. The Ge contents determined using the external method and the standard addition method were 9.45 mg kg?1 and 9.24 mg kg?1, respectively, and the P contents, using the same methods, were 22.49 mg kg?1 and 23.09 mg kg?1, respectively. Both methods were successfully used to determine the trace amounts of P and Ge in the pure gold bonding wire samples.
机译：电感耦合等离子体原子发射光谱法（ICP-AES）用于确定纯金键合线中锗和磷的存在。在室温下将样品用氢溴酸和硝酸溶解。锗的定量限为265.118 nm处的0.012 mg L？1，磷的177.495 nm处为0.009 mg L？1。使用DIW + HBr + HNO3的混合酸消解公式，回收率在98-100％的范围内相对标准偏差在1.1-2.3％之间。另一方面，由于形成了挥发性化合物，使用DIW + HCl + HNO3时，Ge的含量减少了约16.2％。使用外部方法和标准添加方法测定的Ge含量分别为9.45 mg kg？1和9.24 mg kg？1，并且使用相同方法测得的P含量为22.49 mg kg？1和23.09 mg kg？1 ， 分别。两种方法均成功用于测定纯金键合线样品中的痕量P和Ge。

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