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首页> 外文期刊>Applied Microbiology >Mechanism of Copper Surface Toxicity in Vancomycin-Resistant Enterococci following Wet or Dry Surface Contact
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Mechanism of Copper Surface Toxicity in Vancomycin-Resistant Enterococci following Wet or Dry Surface Contact

机译：湿或干表面接触后耐万古霉素的肠球菌中铜表面毒性的机理

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Contaminated touch surfaces have been implicated in the spread of hospital-acquired infections, and the use of biocidal surfaces could help to reduce this cross-contamination. In a previous study we reported the death of aqueous inocula of pathogenic Enterococcus faecalis or Enterococcus faecium isolates, simulating fomite surface contamination, in 1 h on copper alloys, compared to survival for months on stainless steel. In our current study we observed an even faster kill of over a 6-log reduction of viable enterococci in less than 10 min on copper alloys with a “dry” inoculum equivalent to touch contamination. We investigated the effect of copper(I) and copper(II) chelation and the quenching of reactive oxygen species on cell viability assessed by culture and their effects on genomic DNA, membrane potential, and respiration in situ on metal surfaces. We propose that copper surface toxicity for enterococci involves the direct or indirect action of released copper ionic species and the generation of superoxide, resulting in arrested respiration and DNA breakdown as the first stages of cell death. The generation of hydroxyl radicals by the Fenton reaction does not appear to be the dominant instrument of DNA damage. The bacterial membrane potential is unaffected in the early stages of wet and dry surface contact, suggesting that the membrane is not compromised until after cell death. These results also highlight the importance of correct surface cleaning protocols to perpetuate copper ion release and prevent the chelation of ions by contaminants, which could reduce the efficacy of the surface.
机译：污染的触摸表面与医院获得性感染的传播有关，使用杀菌表面可以帮助减少这种交叉污染。在先前的研究中，我们报道了致病性肠球菌或粪肠球菌分离株的水性接种物的死亡，模拟了铜合金在1小时内表面的污染，而在不锈钢上存活了数月。在我们目前的研究中，我们观察到在不到10分钟的时间内，铜合金的干肠球菌等效于接触污染，杀死肠球菌的速度甚至降低了6个对数以上。我们研究了铜（I）和铜（II）螯合的影响以及活性氧的淬灭对通过培养评估的细胞活力及其对基因组DNA，膜电位和金属表面原位呼吸的影响。我们提出，肠球菌的铜表面毒性涉及释放的铜离子物质的直接或间接作用以及超氧化物的产生，导致呼吸停止和DNA分解为细胞死亡的第一阶段。 Fenton反应产生的羟基自由基似乎并不是DNA损伤的主要手段。在湿和干表面接触的早期阶段，细菌膜的电位不会受到影响，这表明直到细胞死亡后，膜才不会受到损害。这些结果还强调了正确的表面清洁规程对于保持铜离子释放并防止污染物与离子螯合的重要性，这可能会降低表面的功效。

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