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Bacterial Killing by Dry Metallic Copper Surfaces

机译:干燥金属铜表面的细菌杀灭

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Metallic copper surfaces rapidly and efficiently kill bacteria. Cells exposed to copper surfaces accumulated large amounts of copper ions, and this copper uptake was faster from dry copper than from moist copper. Cells suffered extensive membrane damage within minutes of exposure to dry copper. Further, cells removed from copper showed loss of cell integrity. Acute contact with metallic copper surfaces did not result in increased mutation rates or DNA lesions. These findings are important first steps for revealing the molecular sensitive targets in cells lethally challenged by exposure to copper surfaces and provide a scientific explanation for the use of copper surfaces as antimicrobial agents for supporting public hygiene.
机译:金属铜表面可快速有效地杀死细菌。暴露于铜表面的电池会积累大量的铜离子,干铜比湿铜吸收铜的速度更快。在暴露于干铜的几分钟内,细胞遭受了广泛的膜损伤。此外,从铜中移出的电池显示出电池完整性的损失。与金属铜表面的急性接触不会导致突变率或DNA损伤的增加。这些发现是揭示暴露于铜表面致死的细胞中分子敏感靶标的重要第一步,并为使用铜表面作为支持公众卫生的抗菌剂提供了科学解释。

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