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Enhanced thermal conductivity of epoxy composites filled with tetrapod-shaped ZnO

机译：填充四脚形ZnO的环氧复合材料的导热性增强

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摘要

Epoxy composites with ZnO powders characterized by different structures as inclusion are prepared and their thermal properties are studied. The experimental results demonstrate that the epoxy resins filled by tetrapod-shaped ZnO (T-ZnO) whiskers have the superior thermal transport property in comparison to ZnO micron particles (ZnO MPs). The thermal conductivity of ZnO/epoxy and T-ZnO/epoxy composites in different mass fraction (10, 20, 30, 40, 50?wt%) are respectively investigated and the suitable models are compared to explain the enhancement effect of thermal conductivity. The thermal conductivity of T-ZnO/epoxy composites with 50 wt% filler reaches 4.38 W m ~(?1) K ~(?1) , approximately 1816% enhancement as compared to neat epoxy. In contrast, the same mass fraction of ZnO MPs are incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is because T-ZnO whiskers act as a thermal conductance bridge in the epoxy matrix. In addition, the other thermal properties of T-ZnO/epoxy composites are also improved. Furthermore, the T-ZnO/epoxy composite also presents a much reduced coefficient of thermal expansion (～28.1 ppm K ~(?1) ) and increased glass transition temperature (215.7 °C). This strategy meets the requirement for the rapid development of advanced electronic packaging.
机译：制备了具有不同结构的夹杂物的ZnO粉环氧树脂复合材料，并对其热性能进行了研究。实验结果表明，与ZnO微米颗粒（ZnO MPs）相比，用四脚形ZnO（T-ZnO）晶须填充的环氧树脂具有优异的热传输性能。分别研究了不同质量分数（10、20、30、40、50？wt％）的ZnO /环氧树脂和T-ZnO /环氧树脂复合材料的导热系数，并通过比较合适的模型来说明导热系数的提高效果。填料含量为50％（重量）的T-ZnO /环氧树脂复合材料的热导率达到4.38 W m〜（？1）K〜（？1），与纯环氧树脂相比提高了约1816％。相反，将相同质量分数的ZnO MP掺入环氧树脂基体中，对导热性能的改善较小。这是因为T-ZnO晶须在环氧树脂基质中充当热导桥。此外，T-ZnO /环氧树脂复合材料的其他热性能也得到改善。此外，T-ZnO /环氧复合材料还具有大大降低的热膨胀系数（〜28.1 ppm K〜（？1））和提高的玻璃化转变温度（215.7°C）。该策略满足了高级电子封装快速发展的要求。

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