• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>RSC Advances >Fabrication of 3D conductive circuits: print quality evaluation of a direct ink writing process
【24h】

Fabrication of 3D conductive circuits: print quality evaluation of a direct ink writing process

机译：3D导电电路的制造：直接墨水书写过程的打印质量评估

获取原文
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

The use of conductive inks and direct writing techniques for the fabrication of electronic circuits on complex substrates is attracting ever increasing interest. However, the existing knowledge is only focused on the electrical performances of the produced smart objects with no direct correlation with the conductive paths morphology and printing conditions. In order to evaluate the printing quality of a direct writing process using an eccentric screw dispenser, a printing device for the deposition of silver paste on 3D objects was developed. Lines of different widths were printed on flat PC + ABS substrates by means of the developed printing device and a conventional screen printing process. The developed process permitted printing lines as thin as possible with screen printing but with a better regularity of their edges. However unlike screen printed lines, the thickness of the lines was dependent on their width. Finally, the possibility to print on 3D objects was demonstrated.
机译：导电油墨和直接书写技术用于在复杂基板上制造电子电路的兴趣日益增长。但是，现有知识仅集中在生产的智能对象的电气性能上，而与导电路径的形态和打印条件没有直接关系。为了评估使用偏心螺丝分配器的直接书写过程的打印质量，开发了一种用于在3D对象上沉积银浆的打印设备。通过开发的印刷设备和常规的丝网印刷工艺，将不同宽度的线印刷在平板PC + ABS基板上。发达的工艺可以使丝网印刷时的印刷线尽可能细，但边缘的规则性更好。但是，与丝网印刷线不同，线的粗细取决于其宽度。最后，演示了在3D对象上打印的可能性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号