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A novel h-BN–RGO hybrids for epoxy resin composites achieving enhanced high thermal conductivity and energy density

机译：用于环氧树脂复合材料的新型h-BN–RGO杂化材料，具有更高的高导热性和能量密度

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In recent decades, significant attention has been focused on developing composite materials with high thermal conductivity utilizing h-BN, which has outstanding thermal conductivity. However, the enhancement in thermal conductivity by using h-BN is commonly limited because of high thermal resistance between h-BN and polymer materials. Herein, we fabricated novel h-BN–RGO hybrids (h-BN–RGO), by electrostatic assembly between h-BN and GO. It is found that the addition of h-BN–RGO hybrids into epoxy resins can enhance the thermal conductivity. The samples containing 26.04 vol% h-BN–RGO exhibit the highest thermal conductivity (3.45 W m?1 K?1), which is as high as 16 times that of neat epoxy resin (0.24 W m?1 K?1). The epoxy resins/h-BN–RGO composites also exhibit an enhanced dielectric constant (11.12) and low loss tangents (0.05). The energy density of the composites reaches 0.51 J cm?3 in the composites with 26.04 vol%, which is 79.6% higher than that of the pure epoxy. We attribute the enhanced thermal conductivity to the well-designed h-BN–RGO interface as well as the good dispersion of BN–RGO hybrids in epoxy resin. The energy density is mainly due to the absorbed effect of RGO nanosheets at the BN surface and its good dispersion in comparison with pure BN. This work offers a new insight into the methods for the improvement of thermal conductivity and energy storage characteristics, which has potential applications in integrated circuit packaging and structural energy storage.
机译：在最近的几十年中，大量的注意力集中在利用具有优异导热性的h-BN来开发具有高导热性的复合材料上。然而，由于h-BN与聚合物材料之间的高热阻，使用h-BN提高热导率通常受到限制。在这里，我们通过在h-BN和GO之间进行静电组装，制造了新颖的h-BN-RGO杂种（h-BN-RGO）。发现将h-BN-RGO杂化物添加到环氧树脂中可以增强导热性。含有26.04 vol％h-BN–RGO的样品表现出最高的热导率（3.45 W m ？1 K ？1 < / small>），是纯环氧树脂的0.2倍（0.24 W m ？1 K ？1 ）。环氧树脂/ h-BN-RGO复合材料还具有增强的介电常数（11.12）和低损耗角正切（0.05）。在26.04％（体积）的复合材料中，复合材料的能量密度达到0.51 J cm ？3 ，比纯环氧树脂高79.6％。我们将提高的热导率归因于精心设计的h-BN-RGO界面以及BN-RGO杂化物在环氧树脂中的良好分散性。能量密度主要归因于RGO纳米片在BN表面的吸收作用以及与纯BN相比良好的分散性。这项工作为改善导热性和能量存储特性的方法提供了新的见识，这些方法在集成电路封装和结构能量存储中具有潜在的应用。

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