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Preparation of polyimide films via microwave-assisted thermal imidization

机译：微波辅助热酰亚胺化制备聚酰亚胺薄膜

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摘要

A series of polyimide (PI) films based on aromatic heterocyclic monomers of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), p -phenylenediamine (p-PDA) and 4,4′-oxydianiline (ODA) were prepared via a microwave-assisted thermal imidization and conventional thermal imidization method at different temperatures. The effects of microwave irradiation on the imidization degree, microstructures, mechanical and thermal properties of PI films were investigated. The imidization degree of the PI films treated with microwave-assisted heating reached a relatively high value at 250 °C, which was twice as much as those treated with traditional thermal imidization. The tensile strength and modulus of PI films treated with microwave-assisted imidization at 300 °C were 187.61 MPa and 2.71 GPa respectively, which were 30% higher than those of PI films treated with thermal imidization. Moreover, the order degree of polymer chains was improved by the microwave-assisted imidization method. The PI films prepared by the microwave-assisted imidization method showed excellent thermal stability with a 5% weight loss temperature of 573 °C under N _(2) . The microwave-assisted thermal imidization proved to be a rapid and efficient way to prepare high-performance polyimide materials.
机译：制备了一系列基于3,3'，4,4'-联苯四甲酸二酐（BPDA），对苯二胺（p-PDA）和4,4'-氧二苯胺（ODA）的芳香族杂环单体的聚酰亚胺（PI）膜通过微波辅助热酰亚胺化和常规热酰亚胺化方法在不同温度下进行。研究了微波辐照对PI薄膜的酰亚胺化程度，微观结构，力学性能和热性能的影响。微波辅助加热处理的PI膜的酰亚胺化程度在250°C时达到较高值，是传统热酰亚胺化处理的PI膜的两倍。 300℃微波辅助酰亚胺化处理的PI薄膜的拉伸强度和模量分别为187.61 MPa和2.71 GPa，比热酰亚胺化处理的PI薄膜高30％。此外，通过微波辅助的酰亚胺化方法提高了聚合物链的有序度。在N _（2）下，微波辅助酰亚胺化法制备的PI薄膜具有573％的5％失重温度，具有优异的热稳定性。事实证明，微波辅助的热酰亚胺化是制备高性能聚酰亚胺材料的一种快速有效的方法。

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