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Hybrid fillers of hexagonal and cubic boron nitride in epoxy composites for thermal management applications

机译：用于热管理应用的环氧复合材料中六方和立方氮化硼的混合填料

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In this study, the synergistic effect of hexagonal boron nitride (h-BN) with cubic boron nitride (c-BN) on enhancement of thermal conductivity of epoxy resin composites has been reported. The measured thermal conductivities of the epoxy composites filled with h-BN, c-BN and hybrid h-BN/c-BN compared with the theoretical predications of Agari's model strongly suggest that the combination of h-BN platelets and c-BN spherical particles with different sizes is beneficial to enhance the thermal conductivity of the polymer composites by preferentially forming 3D thermally conductive networks at low loading content. Furthermore, the small addition of gold nanoparticles enhances the thermal conductivity from 166% to 237%. The potential application of these composites for thermal management has been demonstrated by the surface temperature variations in real time during heating. The results demonstrate that such thermally conductive but electrically insulating polymer-based composites are highly desirable for thermal management applications.
机译：在这项研究中，已报道了六方氮化硼（h-BN）与立方氮化硼（c-BN）的协同作用，可增强环氧树脂复合材料的导热性。与Agari模型的理论预测相比，填充h-BN，c-BN和杂化h-BN / c-BN的环氧复合材料的实测热导率强烈表明h-BN血小板和c-BN球形颗粒的组合具有不同尺寸的材料有利于通过优先形成低负荷含量的3D导热网络来增强聚合物复合材料的导热性。此外，少量添加金纳米颗粒可将热导率从166％提高到237％。这些复合材料在热管理方面的潜在应用已经通过加热过程中实时的表面温度变化得到了证明。结果表明，这种导热但电绝缘的聚合物基复合材料对于热管理应用是非常需要的。

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