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首页> 外文期刊>RSC Advances >Cyclic voltammetry growth and characterization of Sn–Ag alloys of different nanomorphologies and compositions for efficient hydrogen evolution in alkaline solutions
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Cyclic voltammetry growth and characterization of Sn–Ag alloys of different nanomorphologies and compositions for efficient hydrogen evolution in alkaline solutions

机译：不同纳米形态和成分的Sn-Ag合金的循环伏安法生长和表征，可在碱性溶液中有效地释放氢气

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Electrodeposition of silver, tin and their alloys from different aqueous electrolytes suffer from various environmental issues and deposits are affected by H _(2) evolution and metal oxide formation. In this work, these metals and their alloys are electrodeposited by cyclic voltammetry utilizing ionic liquids based on C _(5) H _(14) ClNO (choline chloride) that permits deposit properties control. Both Ag and Sn concentrations in the ionic liquid were varied from 0.01 to 0.15 mol L ~(?1) . Methionine effect on the reduction potential of Sn and Ag was studied. Different techniques were applied to explore the structures, morphologies, and electrochemical (EC) activities of the deposits. A single Ag _(3) Sn phase with orthorhombic packed structure was observed for all alloys, whereas the preferred growth orientation was varied from (202) to (112) depending on Ag%. Also, the dislocation density is decreased by increasing Ag content. EDX spectra showed only Ag and Sn signals indicating the high purity of the Sn–Ag alloys. The deposit from Sn-rich liquid showed rougher and larger agglomerates at the surface than that formed from the Ag-rich liquids with or without methionine. The electrochemical activities of the deposits toward the H _(2) evolution reaction (HER) were investigated through electrochemical polarization (ECP) measurements and EC impedance spectroscopies (EISs). The Sn–Ag alloys possess higher performance, as a catalyst for HER using alkaline solution, than Ag or Sn electrodes. The highest rate of HER was recorded for Sn–35% Ag and Sn–97% Ag deposits, which correlated strongly to the microstructure and surface morphology. The ECP results were confirmed by EIS investigations. The measured impedance values are close-fitting to a hypothetical model for the electrode/electrolyte interface.
机译：从不同的水性电解质中电沉积银，锡及其合金存在各种环境问题，并且沉积物受H_（2）析出和金属氧化物形成的影响。在这项工作中，使用基于C_（5）H_（14）ClNO（氯化胆碱）的离子液体，通过循环伏安法对这些金属及其合金进行电沉积，从而可以控制沉积性能。离子液体中的Ag和Sn浓度都在0.01到0.15 mol L〜（？1）之间变化。研究了蛋氨酸对锡和银还原电位的影响。应用了不同的技术来探索沉积物的结构，形态和电化学（EC）活性。对于所有合金，均观察到具有正交晶堆积结构的单个Ag_（3）Sn相，而根据Ag％的不同，优选的生长方向从（202）到（112）。另外，通过增加Ag含量来降低位错密度。 EDX光谱仅显示Ag和Sn信号，表明Sn-Ag合金的纯度很高。来自富锡液体的沉积物在表面显示出比由有或没有蛋氨酸的富银液体形成的沉积物更粗糙和更大的附聚物。通过电化学极化（ECP）测量和EC阻抗谱（EIS）研究了沉积物对H_（2）析出反应（HER）的电化学活性。 Sn-Ag合金作为使用碱性溶液的HER催化剂比Ag或Sn电极具有更高的性能。记录到的Sn–35％Ag和Sn–97％Ag沉积物的最高HER率与微观结构和表面形态密切相关。 ECP调查结果证实了ECP的结果。测得的阻抗值非常适合电极/电解质界面的假设模型。

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