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The deviations of evaporation modes in two different morphologies of 2D WS2 film

机译:二维WS2膜在两种不同形态下的蒸发模式偏差

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Exploring the inverse process of materials growth, evaporation of atoms from the material, is a crucial method to investigate the physical properties of two dimensional (2D) nanomaterials. Here, the evaporation modes of two different morphologies of 2D WS _(2) film, stacked film and normal film, were investigated by thermal annealing. It is found that the atomic evaporation rate increases and the crystallinity deteriorates when annealing temperature rises. During the evaporation process, atom evaporation firstly starts from the boundaries and defects. The evaporation rate is proportional to the free energy of S and W atoms, and inversely proportional to the local S–W atomic concentration. There is a striking difference in the evaporation modes between stacked film and normal film; layer-by-layer peeling off the surface only appears in normal film. These results imply that the interlayer coupling strength of stacked film is greater than that of the normal film with uniform thickness.
机译:探索材料生长的逆过程,即原子从材料中蒸发,是研究二维(2D)纳米材料物理特性的关键方法。在这里,通过热退火研究了两种不同形态的二维WS_(2)薄膜,叠层薄膜和普通薄膜的蒸发模式。发现当退火温度升高时,原子蒸发速率增加并且结晶度劣化。在蒸发过程中,原子的蒸发首先从边界和缺陷开始。蒸发速率与S和W原子的自由能成正比,与当地的S-W原子浓度成反比。堆叠膜和普通膜之间的蒸发模式存在显着差异。仅在普通薄膜中会出现逐层剥落表面的现象。这些结果表明,叠层膜的层间耦合强度大于具有均匀厚度的普通膜的层间耦合强度。

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