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首页> 外文期刊>Coatings >Thermal Fatigue Failure Behavior of Surface/Interface of Plasma Cladding Layer
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Thermal Fatigue Failure Behavior of Surface/Interface of Plasma Cladding Layer

机译：等离子体包层表面/界面的热疲劳失效行为

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Co-based coating was prepared by plasma cladding on FV520B substrates. Microstructure of the coatings was observed by scanning electron microscope. Finite element simulation as a predictive method to research the stress distributed after thermal cycling. Thermal fatigue resistance of the coating-substrate was evaluated at temperature of 600 °C, 700 °C, 800 °C, and 900 °C. Results indicate that the surface/interface structure has excellent thermal fatigue resistance at 600 °C, and the thermal fatigue crack initiated near the interface and extended along the grain boundary. The difference of expansion coefficient of the coating and substrate is small near 600 °C, and the difference increased when the temperature climbed above 600 °C. The diffuse elements could be found near the interface after the thermal cycle, and the dislocations and precipitated phase were observed.
机译：通过对FV520B基材上的等离子体包层制备CO基涂层。通过扫描电子显微镜观察涂层的微观结构。有限元模拟作为研究热循环后分布应力的预测方法。在600℃，700℃，800℃和900℃的温度下评价涂层基板的热疲劳电阻。结果表明，表面/界面结构在600℃下具有优异的热疲劳电阻，并且在界面附近启动的热疲劳裂纹并沿晶界延伸。涂层和衬底的膨胀系数差异较小，近600℃，当温度爬升到600℃以上时，差异增加。在热循环之后，可以在界面附近找到漫射元件，并且观察到脱臼和沉淀相。

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