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首页> 外文期刊>International Journal of Electrochemical Science >The Effects of Microstructure and Ag3Sn and Cu6Sn5 Intermetallics on the Electrochemical Behavior of Sn-Ag and Sn-Cu Solder Alloys
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The Effects of Microstructure and Ag3Sn and Cu6Sn5 Intermetallics on the Electrochemical Behavior of Sn-Ag and Sn-Cu Solder Alloys

机译：微观结构和Ag 3 Sn和Cu ​​ 6 Sn 5 金属间金属间金属间体对Sn-Ag和Sn-Cu焊料合金电化学行为的影响

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摘要

The aim of this study is to evaluate the electrochemical corrosion behavior of Sn-2 wt.% Ag and Sn- o 2.8 wt.% Cu solder alloys in a 0.5 M NaCl solution at 25 C as a function of microstructure featuresand Ag3Sn and Cu6Sn5 intermetallics. Both Sn-Ag and Snu alloys are becoming interesting lead- free solder alternatives. Microstructure morphologies obtained from a vertical water-cooledo unidirectional solidification system under a cooling rate of about 15 C/s are analyzed. Electrochemicalimpedance spectroscopy (EIS) diagrams, potentiodynamic polarization curves and an equivalent circuitanalysis were used to evaluate the electrochemical parameters. It was found that although the relativecost 1.5 times higher for the Sn-2Ag alloy compared to that of the Sn-2.8Cu alloy, its correspondingelectrochemical behavior is better in terms of polarization resistance, current density and pittingcorrosion. This is shown to be intimately associated with the resulting fine and homogeneouslydistributed Ag3Sn intermetallic particles in the Sn-rich matrix.
机译：本研究的目的是评估Sn-2重量％的电化学腐蚀行为和SN-O 2.8重量％。在25℃下，0.5M NaCl溶液中的IS Cu焊料合金，如微观结构特征的函数，Ag3Sn和Cu6Sn5金属间金属间。 SN-AG和SNU合金都变得有趣的无铅焊剂替代品。分析从垂直水 - 冷却单向凝固系统获得的微观结构形态，在约15c / s的冷却速率下进行。电化学测距光谱（EIS）图，电位动力学偏振曲线和等效电路分析用于评估电化学参数。结果发现，与Sn-2.8Cu合金相比，Sn-2Ag合金相比，虽然Sn-2Ag合金相比，其相应的电化学行为在偏振电阻，电流密度和斑纹腐蚀方面更好。这显示它与所得的富含Sn的基质中所得精细和同次分布的Ag3SN金属间颗粒密切相关。

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