首页> 外文期刊>St. Petersburg Polytechnic University Journal: Physics and Mathematics >Effect of temperature on properties of DLC films and DLC-Ni:C sandwich growth
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Effect of temperature on properties of DLC films and DLC-Ni:C sandwich growth

机译:温度对DLC薄膜和DLC-NI性能的影响:C夹层生长

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A possibility of formation of sandwich structures comprising of both DLC and nano-crystalline Ni-Carbon films on silicon substrate is presented. The influence of DLC film exposition to high temperature during preparation of Ni:C layers on its properties has been investigated by means of isochronal thermal annealing in carrying gas used. All structures obtained were examined by atomic force microscopy, scanning electron microscopy and X-ray photoelectron spectroscopy. It has been established that annealing leads to decrease of the internal residual stress in the DLC films as well as causes swelling of samples with temperature rise.The fraction of sp{3} hybridized bonds increases and the sp{2} fraction symmetrically decreases with increase of annealing temperature. The different sequences of growth processes to obtain DLC-Ni:c-DLC sandwich structure were investigated. The best way to get good structure quality is to grow initial DLC film at 200 V and 100 W and Ni:C layer at 500 °c.
机译:呈现了包含在硅衬底上的DLC和纳米结晶Ni-碳膜的夹层结构的形成。通过使用的携带气体中的同胞影热退火研究了DLC膜曝光在Ni:C层期间对高温的影响。通过原子力显微镜,扫描电子显微镜和X射线光电子能量检查所得所有结构。已经确定退火导致DLC薄膜中的内部残余应力的降低以及导致样品的肿胀随温度升高。SP {3}杂交键的分数增加,SP {2}比对称地降低了退火温度。研究了获取DLC-Ni的不同生长过程序列:C-DLC夹层结构。获得良好结构质量的最佳方法是在500°C下将初始DLC薄膜延长为200 V和100 W和Ni:C层。

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