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Research on the thermal conductivity and dielectric properties of AlN and BN co-filled addition-cure liquid silicone rubber composites

机译:ALN和BN共填充加固液硅橡胶复合材料的导热性和介电性能研究

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The present work aims at studying the thermal and dielectric properties of addition-cure liquid silicone rubber (ALSR) matrix composites using boron nitride (BN) and aluminum nitride (AlN) as a hybrid thermal conductive filler. Composite samples with different filler contents were fabricated, and the density, thermal conductivity, thermal stability, dielectric properties, and volume resistivity of the samples were measured. According to the experimental results, the density, thermal conductivity, dielectric constant and dielectric loss tangent values all increased with the increasing addition of filler. When the weight fraction of hBN filler was 50 wt%, the thermal conductivity of composites was 0.554 W (m ~(?1) K ~(?1) ), which is 3.4 times higher than that of pure ALSR. The corresponding relative permittivity and dielectric loss were 3.98 and 0.0085 at 1 MHz, respectively. Furthermore, TGA results revealed that the AlN/BN hybrid filler could also improve the thermal stability of ALSR. The volume resistivity of ALSR composites was higher than that of pure ALSR. The addition of fillers improved the thermal properties of ALSR and had little effect on its insulation properties. This characteristic makes ALSR composites attractive in the field of insulating materials.
机译:本工作旨在使用氮化硼(BN)和氮化铝(ALN)作为杂化热导体填料来研究附加固化液硅橡胶(ALSR)基质复合材料的热和介电性能。制造具有不同填料内容物的复合样品,并测量密度,导热性,热稳定性,电介质性能和样品的体积电阻率。根据实验结果,随着添加的填料的增加,密度,导热性,介电常数和介电损耗切线均增加。当HBN填料的重量级分为50wt%时,复合材料的导热率为0.554W(m〜(Δ1)k〜(α1)),其比纯Alsr高3.4倍。相应的相对介电常数和介电损耗分别为1MHz为3.98和0.0085。此外,TGA结果显示ALN / BN杂交填料还可以提高ALSR的热稳定性。 ALSR复合材料的体积电阻率高于纯AlSR。添加填料改善了AlSR的热性质,对其绝缘性能几乎没有影响。这种特性使ALSR复合材料在绝缘材料领域具有吸引力。

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