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In situ polymerization of graphene-polyaniline@polyimide composite films with high EMI shielding and electrical properties

机译：石墨烯 - 聚苯胺的原位聚合用高EMI屏蔽和电气性能的聚酰亚胺复合膜

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摘要

With the increasing demands of the electronics industry, electromagnetic interference (EMI) shielding has become a critical issue that severely restricts the application of devices. In this work, we have proposed a “non-covalent welding” method to fabricate graphene-polyaniline (Gr-PANI) composite fillers. The Gr sheets are welded with PANI via π–π non-covalent interactions. Furthermore, a flexible polyimide (PI) composite film with superior EMI shielding effectiveness is prepared by in situ polymerization. The 40% content of Gr-PANI _(10:1) (the mass ratio of Gr to PANI is 10?:?1) shows a superior electrical conductivity ( σ ) as high as 2.1 ± 0.1 S cm ~(?1) , 1.45 times higher than that of Gr@PI film at the same loading. Moreover, the total shielding effectiveness (SE _(T) ) of EMI of the Gr-PANI _(10:1) @PI reaches ～21.3 dB and an extremely high specific shielding effectiveness value (SSE) of 4096.2 dB cm ~(2) g ~(?1) is achieved. Such a “non-covalent welding” approach provides a facile strategy to prepare high-performance PI-based materials for efficient EMI shielding.
机译：随着电子工业需求的日益增长，电磁干扰（EMI）屏蔽已成为严重限制设备应用的关键问题。在这项工作中，我们提出了一种“非共价焊接”方法来制造石墨烯 - 聚苯胺（GR-PANI）复合填料。通过π-π非共价相互作用，用PANI焊接GR片。此外，通过原位聚合制备具有优异的EMI屏蔽效果的柔性聚酰亚胺（PI）复合膜。 GR-PANI _（10：1）的40％含量（GR对PANI的质量比为10？：1）显示出高达2.1±0.1 S cm〜（Δ1）的优异的导电性（σ） ，比同一负载的1.45倍高1.45倍。此外，GR-PANI _（10：1）@PI的EMI的总屏蔽效果（SE _（T））达到〜21.3 dB，极高的特定屏蔽效果值（SSE）为4096.2 db cm〜（2实现了g〜（？1）。这种“非共价焊接”方法提供了一种用于制备高性能PI基材料的容易策略，以实现高效的EMI屏蔽。

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