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Bonding of thermoplastic microfluidics by using dry adhesive tape

机译:使用干胶带粘接热塑性微流体

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In this study, we investigated the effects of adhesive tape structure, adhesive tape thickness (30, 60, and 80 μm), and bonding time (5 and 15 seconds) on the bonding of inflexible and flexible substrates. We performed microchannel bonding by using a manual scraper press or a hot press machine. Rapid prototyping and mass production capabilities were achieved in the dry adhesive tape bonding of polymer microfluidic systems with both the aforementioned approaches. With process control, 95.16% and 99.53% bonding coverage could be achieved for the inflexible and flexible substrates, respectively, by using a manual scraper press. When using a press machine, the bonding coverage could be further enhanced to 99.24% for the inflexible substrates and 99.81% for the flexible substrates. Due to the viscoelastic nature of the adhesive layer in the adhesive tapes, we observed Saffman–Taylor finger and air bubble formation around the microchannel under high pumping pressure. The results indicated that the probability of Saffman–Taylor finger formation was lower and the bonding pressure was higher when using the thinner adhesive tape than when using thicker tape. Moreover, due to their rigidity, the inflexible substrates exhibited a higher bonding strength than the flexible substrates did. Bonding stability tests indicated that the bonded substrates had high bonding quality and bonding strength under long-term storage of up to 60 days.
机译:在这项研究中,我们研究了粘合带结构,粘合带厚度(30,60和80μm)的影响,以及粘合时间(5和15秒)在粘合和柔性基板的粘合上。我们通过使用手动刮刀或热压机进行了微通道键合。在具有上述方法的高分子微流体系统的干粘合带键合中实现了快速的原型和批量生产能力。通过使用手动刮板压力机,可以分别为粘合和柔性基板的粘接覆盖率进行95.16%和99.53%的粘接覆盖。使用压力机时,可进一步增强粘接覆盖率为柔性基材的粘合基材和99.81%的99.24%。由于粘合剂胶带中粘合剂层的粘弹性,我们在高泵送压力下观察了在微通道周围的Saffman-Taylor手指和气泡形成。结果表明,当使用较薄的胶带时,Saffman-Taylor指状面积的概率较低,粘接压力比使用更厚的胶带更高。此外,由于它们的刚性,不灵活的基板表现出比柔性基板更高的粘合强度。粘接稳定性试验表明,在长期储存的长期储存下,粘合的基材具有高达60天的高键合质量和粘合强度。

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